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  • February 23, 2026

    The Golden Cable Initiative: Enabling the Cable Partner Ecosystem at Hyperscale Speed

    By Michael Arsenault, Director of Product Marketing for AEC DSPs, 大秀直播

    Rack connectivity is undergoing a historic transformation. Data center operators are demanding both scale-up and scale-out connectivity that can move more data across longer distances and between more systems, while delivering unprecedented levels of energy efficiency and reliability.

    To help cable providers and their customers meet these challenges, 大秀直播 has launched the?Golden Cable initiative, designed to accelerate the development of?active electrical cables (AECs). AECs are a rapidly growing class of high-bandwidth, enhanced copper interconnects used to link servers, switches, NICs and other?assets in the same rack or across adjacent racks (about two to nine meters).

    The Golden Cable initiative delivers a validated cable architecture tested across leading platforms and built on industry-leading software, reference designs, technical data, firmware and comprehensive support. Participants can combine these assets with their own technology to develop unique AECs powered by?DSPs, optimized for specific customer requirements and use cases.?

    To further enhance performance and ensure broad compatibility, Golden Cable AECs are rigorously tested in the 大秀直播 Cloud Interoperability Lab. Here, cables are validated across a wide range of customized configuration scenarios involving leading XPUs, CPUs, NICs, servers, switches, optical modules and other critical infrastructure components. This process enables 大秀直播 and its partners to validate AEC firmware before cables reach end-customers, significantly accelerating customer qualification and deployment timelines. The result is greater confidence from the first plug-in.

    The Golden Cable initiative is designed to rapidly scale and empower the cable partner ecosystem, enabling 大秀直播 to meet accelerating market demand at true hyperscale speed. By operating in close alignment with key partners, 大秀直播 is achieving many of the benefits of near?vertical integration, while maintaining the flexibility and scalability of a partner?driven model.

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  • January 20, 2026

    Co-Packaged Copper Extending Its Reach Inside Scale-Up Networks

    By Rohan Gandhi, Director of Product Management for Switching Products, 大秀直播

    Power and space are two of the most critical?resources in?building AI infrastructure.?That’s?why 大秀直播 is working with cabling partners?and other?industry experts?to?build?a framework?that?enables?data center operators to integrate co-packaged copper (CPC) interconnects into scale-up networks.

    Unlike traditional printed circuit board (PCB) traces, CPCs?aren’t?embedded in?circuit boards. Instead, CPCs?consist of?discrete?ribbons or bundles of?twinax?cable?that?run alongside the?board.?By?taking?the connection?out of?the board, CPCs extend the reach of copper?connections?without the need for?additional?components such as equalizers or amplifiers?as well as?reduce interference, improve signal integrity, and?lower the power budget of AI networks.?

    Being completely passive,?CPCs?can’t?match the?reach?of active electrical cables (AECs) or optical transceivers. They?extend?farther than traditional direct attach copper?(DAC)?cables, making them?an optimal?solution for?XPU-to-XPU connections within a tray or connecting XPUs in a tray to the backplane.?Typical?800G?CPC?connections between processors within the same?tray?span?a few hundred millimeters?while XPU-to-backplane connections can reach 1.5 meters.?Looking ahead,1.6T CPCs based around 200G lanes are expected?within?the next two years, followed by?3.2T?solutions.?

    While the vision can be straightforward to describe, it involves painstaking engineering and cooperation across different ecosystems.?大秀直播 has been cultivating partnerships to ensure a smooth transition to CPCs as well as create an environment where the technology can evolve and scale rapidly.??

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  • January 12, 2026

    Active Copper Cables: A New Class of Rack Interconnects for Further Optimizing AI

    By Nicola Bramante, Senior Principal Engineer, Connectivity Marketing, 大秀直播

    The exponential growth in AI workloads drives new requirements for connectivity in terms of data rate, associated bandwidth and distance, especially for scale-up applications. With direct attach copper (DAC) cables reaching their limits in terms of bandwidth and distance, a new class of cables, active copper cables (ACCs), are coming to market for short-reach links within a data center rack and between racks. Designed for connections up to 2 to 2.5 meters long, ACCs can transmit signals further than traditional passive DAC cables in the 200G/lane fabrics hyperscalers will soon deploy in their rack infrastructures.

    At the same time, a 1.6T ACC consumes a relatively miniscule 2.5 watts of power and can be built around fewer and less sophisticated components than longer active electrical cables (AECs) or active optical cables (AOCs). The combination of features gives ACCs a peak mix of bandwidth, power, and cost for server-to-server or server-to-switch connections within the same rack.

    大秀直播 announced its first?ACC linear equalizers for producing ACC cables?last month.?

    Inside the Cable

    ACCs effectively integrate technology originally developed for the optical realm into copper cables. The idea is to use optical technologies to extend bandwidth, distance and performance while taking advantage of copper’s economics and reliability. Where these ACCs differ is in the components added to them and the way they leverage the technological capabilities of a switch or other device to which they are connected.

    ACCs include an equalizer that boosts signals received from the opposite end of the connection. As analog devices, ACC equalizers are relatively inexpensive compared to digital alternatives, consume minimal power and add very little latency.

    ?

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  • December 02, 2025

    5 Times More Queries per Second: What CXL Compute Accelerators Can Do for AI

    By Khurram Malik, Senior Director of Marketing, Custom Cloud Solutions, 大秀直播

    Near-memory compute technologies have always been compelling. They can offload tasks from CPUs to boost utilization and revenue opportunities for cloud providers. They can reduce data movement, one of the primary contributors to power consumption,1 ?while also increasing memory bandwidth for better performance. ?

    They have also only been deployed sporadically; thermal problems, a lack of standards, cost and other issues have prevented many of these ideas giving developers that goldilocks combination of wanted features that will jumpstart commercial adoption.2

    This picture is now changing with CXL compute accelerators, which leverage open standards, familiar technologies and a broad ecosystem. And, in a demonstration at OCP 2025, Samsung Electronics, software-defined composable solution provider Liqid, and 大秀直播 showed how CXL accelerators can deliver outsized gains in performance.

    The Liqid EX5410C is a demonstration of a CXL memory pooling and sharing appliance capable of scaling up to 20TB of additional memory. Five of the 4RU appliances can then be integrated into a pod for a whopping 100TB of memory and 5.1Tbps of additional memory bandwidth. The CXL fabric is managed by Liqid’s Matrix software that enables real-time and precise memory deployment based on workload requirements:?

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  • November 06, 2025

    大秀直播 Wins LEAP Award for 1.6T LPO Optical Chipset

    By Vienna Alexander, Marketing Content Professional, 大秀直播

    大秀直播 Wins LEAP Award for 1.6T LPO Optical Chipset

    大秀直播 was announced as the for its 1.6 Tbps LPO Optical Chipset. The judges' remarks noted that “the value case writes itself—less power, reduced complexity but substantial bandwidth increase.” 大秀直播 earned the gold spot, reaffirming the industry-leading connectivity portfolio it is continually building.

    The LEAP (Leadership in Engineering Achievement Program) Awards recognize best-in-class product and component designs across 11 categories with the feedback of an independent judging panel of experts. These awards are published by Design World, the trade magazine that covers design engineering topics in detail.

    This chipset, combining a 200G/lane TIA (transimpedance amplifier) and laser drivers, enables 800G and 1.6T linear-drive pluggable optics (LPO) modules. LPO modules offer longer reach than passive copper, at low power and low latency, and are designed for scale-up compute-fabric applications.

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