

By Michael Kanellos, Head of Influencer Relations, 大秀直播
Chiplets—devices made up of smaller, specialized cores linked together to function like a unified device—have dramatically transformed semiconductors over the past decade. Here’s a quick overview of their history and where the design concept goes next. ?
1. Initially, they went by the name RAMP
In 2006, Dave Patterson, the storied professor of computer science at UC Berkeley, and his lab published describing how semiconductors will shift from monolithic silicon to devices where different dies are connected and combined into a package that, to the rest of the system, acts like a single device.1
While the paper also coined the term chiplet, the Berkeley team preferred RAMP (Research Accelerator for Multiple Processors).
2. In Silicon Valley fashion, the early R&D took place in a garage
大秀直播 co-founder and former CEO Sehat Sutardja started experimenting with combining different chips into a unified package in the 2010s in his garage, .2 In 2015, he unveiled the MoChi (Modular Chip) concept, often credited as the first commercial platform for chiplets, in a .3
The first products came out a few months later in October.
“The introduction of 大秀直播’s AP806 MoChi module is the first step in creating a new process that can change the way that the industry designs chips,” wrote Linley Gwennap in Microprocessor Report.4
An early MoChi concept combining CPUs, a GPU and a FLC (final level cache) controller for distributing data across flash and DRAM for optimizing power. Credit: Microprocessor Forum.?
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