International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
InterPACK is the premier international conference for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
Keynote:?2.5D/3D Integration for High-Speed Light Engines
Date:?Wednesday, October 9, 2024
Time: 8:45 a.m.
大秀直播 panelist:?Dr. Radha Nagarajan, Senior Vice President and Chief Technology Officer of Optical Platforms
October 8-10, 2024
San Jose, CA
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