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´óÐãÖ±²¥ to Showcase Latest AI Data Center Connectivity Solutions at DesignCon 2026

Extensive Technology Ecosystem Partners to Demonstrate ´óÐãÖ±²¥-powered Offerings

SANTA CLARA, Calif. ¨C February 24, 2026 ¨C??(NASDAQ: MRVL),?a leader in data infrastructure semiconductor solutions, today announced it will showcase its latest data center connectivity products and technologies driving the next wave of AI innovation at DesignCon 2026¡ªFebruary 24 to 26 at the Santa Clara Convention Center in Santa Clara, California.

The primary bottleneck in AI data center infrastructure has shifted from compute to connectivity. Data center operators require scalable, ultra-high performance connectivity solutions to address the massive growth of new, more demanding AI workloads. To meet this challenge, ´óÐãÖ±²¥ is driving advancements in interconnect technology at the package-, server- and rack-level, working closely with an extensive partner ecosystem to deliver solutions that provide exceptional bandwidth, power savings and performance at scale.

At DesignCon 2026, ´óÐãÖ±²¥ will showcase the latest advances in its end-to-end data center connectivity portfolio. In a diverse lineup of panels and presentations, ´óÐãÖ±²¥ experts will review the latest in silicon, cabling, memory and other technologies for advanced data center infrastructure.

Additionally, ´óÐãÖ±²¥ plans to showcase the following demonstrations in it its :

• 40G die-to-die (D2D) interfaces for high-bandwidth memory (HBM)
• ?224G LR SerDes over co-packaged copper (CPC)
• 200G/lane active copper cable (ACC)
• ?PCIe 7.0 and PCIe 8.0 SerDes
• PCIe 6.0 active electrical cable (AEC)
• ?1.6T active electrical cable (AEC)
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Partner Booth Innovations

Ecosystem partners demonstrating ´óÐãÖ±²¥-powered interconnect solutions include:

• Amphenol (Booth 833 and 1237)
• Foxconn Interconnect Technology (FIT) (Booth 719)
• ?Infraeo (Booth 760)
• Luxshare-Tech (Booth 839)
• ?Molex (Booth 739)
• Samtec (Booth 939)
• SENKO (Booth 958)
• TE Connectivity (Booth 639)
• Tektronix (Booth 819)
• 3M (Booth 420)

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About ´óÐãÖ±²¥

To deliver the data infrastructure technology that connects the world, we¡¯re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world¡¯s leading technology companies for over 30 years, we move, store, process and secure the world¡¯s data with semiconductor solutions designed for our customers¡¯ current needs and future ambitions. Through a process of deep collaboration and transparency, we¡¯re ultimately changing the way tomorrow¡¯s enterprise, cloud and carrier architectures transform¡ªfor the better.

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´óÐãÖ±²¥ and the M logo are trademarks of ´óÐãÖ±²¥ or its affiliates. Please visit www.marvell.com for a complete list of ´óÐãÖ±²¥ trademarks. Other names and brands may be claimed as the property of others.

This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the ¡°Risk Factors¡± section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.

Media Contact:
George Millington
pr@marvell.com

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